DPS device
Introducing the DPS device that generates a conductive film inside vias as a pretreatment for electroplating copper!
The device can generate a conductive coating inside vias as a pretreatment for electrolytic copper plating for blind vias and through holes. The processing surface is double-sided, and the power supply is AC 200V/220V / 50Hz/60Hz. The device configuration consists of unwinding, degreasing, micro-etching, activation, metallization, stabilization, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.0m/min (depending on specifications) ■ Material width: 70mm to 160mm (for FPC 250 to 300mm) ■ Material thickness: PI 25μm ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
